Product overview

Part Number
SF600G-505005
Manufacturer
CUI Devices
Product Category
Thermal Interface Products
Description
Thermal Interface Products Thermal Pad, Silicone Elastomer, 6.0 W/m*K Thermal Conductivity

Documents & Media

Datasheets
SF600G-505005

Product Attributes

Breakdown Voltage :
2.5 kVAC
Color :
Gray
Length :
50 mm
Material :
Silicone Elastomer
Maximum Operating Temperature :
+ 200 C
Minimum Operating Temperature :
- 58 C
Product :
Thermally Conductive Gap Pad
Series :
SF600G
Tensile Strength :
15 psi
Thermal Conductivity :
6 W/m-K
Thickness :
0.5 mm
Width :
50 mm

Description

Thermal Interface Products Thermal Pad, Silicone Elastomer, 6.0 W/m*K Thermal Conductivity

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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