Product overview
- Part Number
- C1812C151FBTACAUTO7210
- Manufacturer
- KEMET Electronics
- Product Category
- Multilayer Ceramic Capacitors MLCC - SMD/SMT
- Description
- Multilayer Ceramic Capacitors MLCC - SMD/SMT 630Vo 150pF X8G 1812 1% AECQ200
Documents & Media
- Datasheets
- C1812C151FBTACAUTO7210
Product Attributes
- Dielectric :
- X8G
- Maximum Operating Temperature :
- + 150 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Reel
- Qualification :
- AEC-Q200
- Series :
- SMD COMM X8G HVHT150C
- Termination :
- Standard
- Termination Style :
- SMD/SMT
Description
Multilayer Ceramic Capacitors MLCC - SMD/SMT 630Vo 150pF X8G 1812 1% AECQ200
Price & Procurement
Associated Product
You May Also Be Interested In
Part | Manufacturer | Stock | Description |
---|---|---|---|
HF625-0.005-00-131 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
SP1200-0.016-AC-75 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.016 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
HF300P-0.002-00-34 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
PP1000-0.009-AC-30 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP1200/Poly-Pad 1000 |
SP1500ST-0.008-02-53 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.008 Inch Thick, Sil-Pad TSP 1800ST/Sil-Pad 1500ST |
Q3-0.005-00-70 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3 |
HF650P-0.0015-01-9 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
BP100-0.005-00-15 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
HF625-0.005-00-43 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
HF650P-0.0015-01-75 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
SP980-0.009-00-34 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980 |
Q3-0.005-AC-117 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
SP980-0.009-00-104 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980 |
SPK6-0.006-00-137 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6 |
SPK6-0.006-00-47 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6 |