Product overview

Part Number
GRM188R61A184MA01D
Manufacturer
Murata Electronics
Product Category
Multilayer Ceramic Capacitors MLCC - SMD/SMT
Description
Multilayer Ceramic Capacitors MLCC - SMD/SMT

Documents & Media

Product Attributes

Capacitance :
0.18 uF
Case Code - in :
0603
Case Code - mm :
1608
Dielectric :
X5R
Height :
0.8 mm
Maximum Operating Temperature :
+ 85 C
Minimum Operating Temperature :
- 55 C
Packaging :
Cut Tape, MouseReel, Reel
Product :
General Type MLCCs
Series :
GRM
Termination :
Standard
Termination Style :
SMD/SMT
Tolerance :
20 %
Voltage Rating DC :
10 VDC

Description

Multilayer Ceramic Capacitors MLCC - SMD/SMT

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

You May Also Be Interested In

Part Manufacturer Stock Description
581002B00000G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Extruded Heat Sink
574802B03300G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Clip-On Style, Stamped Heat Sink for TO-220, Vertical Mounting, 20.4 n Thermal Resistance, Black Anodized, 1.91mm Hole, Left/Right Side Fins, Solderable Tabs
AER55-55-28CB/A01 CTS Electronic Components 3,000 Heat Sinks Type: Top mount / Shape: Square line fin / Length: 2.150" / Width: 2.150" / Height Off Base: 1.087" / Material: Aluminum Alloy / Material Finish: Black Anodize
conga-QMX8/HSP-B congatec 3,000 Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are with 2.7mm bore hole.
conga-QMX8/HSP-T congatec 3,000 Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread.
conga-SMX8/i-HSP-B congatec 3,000 Heat Sinks Heat spreader solution for SMARC 2.0 module conga-SMX8 with lidded NXP i.MX 8 ARM processor. All standoffs are with 2.7mm bore hole.
RHS5050D Carlo Gavazzi 3,000 Heat Sinks H/S SSR 1-PH X1 PANEL 80X50X51
HAH15L TDK-Lambda 3,000 Heat Sinks Heat Sinks
conga-UMX6/HSP3-B congatec 3,000 Heat Sinks Standard heatspreader for conga-UMX6 module with Non-Lidded FCBGA CPU. Stand-offs are with 2x M2.5 threaded and 2x borehole 2,7mm variants.
RHS45CD Carlo Gavazzi 3,000 Heat Sinks SSR 1PH DIN RAIL HEAT SINK 45X55MM
RHS37A Carlo Gavazzi 3,000 Heat Sinks H/S SSR 1-PH X1 DIN 18X110X52M
RHS10015 Carlo Gavazzi 3,000 Heat Sinks H/S SSR 1-PH X2 DIN 100X82X32MM + ACCES
RHS52A Carlo Gavazzi 3,000 Heat Sinks H/S SSR 1-PH X1 DIN 22.5X110X90MM BLK + ACCES
RHS540D Carlo Gavazzi 3,000 Heat Sinks H/S SSR 1-PH X3 DIN 54X110X51MM BLK + SRW
RHS542 Carlo Gavazzi 3,000 Heat Sinks H/S SSR 1-PH X2 DIN 54X110X51MM BLK + ACCES