Product overview
- Part Number
- VSC8662XIC-03
- Manufacturer
- Microsemi / Microchip
- Product Category
- Ethernet ICs
- Description
- Ethernet ICs 10/100/1000 BaseT Dual Phy
Documents & Media
- Datasheets
- VSC8662XIC-03
Product Attributes
- Data Rate :
- 10 Mb/s, 100 Mb/s, 1 Gb/s
- Interface Type :
- I2C, JTAG, MIIM, SGMII
- Maximum Operating Temperature :
- + 100 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Style :
- SMD/SMT
- Number of Transceivers :
- 2 Transceiver
- Operating Supply Voltage :
- 1.2 V, 3.3 V
- Package / Case :
- BGA-256
- Packaging :
- Tray
- Product :
- Ethernet Transceivers
- Series :
- VSC8662
- Standard :
- 10/100/1GBASE-T
Description
Ethernet ICs 10/100/1000 BaseT Dual Phy
Price & Procurement
Associated Product
You May Also Be Interested In
Part | Manufacturer | Stock | Description |
---|---|---|---|
HF650P-0.002-01-33 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
QII-0.006-AC-115 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II |
BP100-0.008-00-26 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
HF650P-0.001-01-87 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
SP1200-0.012-AC-3 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.012 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
SP1100ST-0.012-02-65 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
SP400-0.009-00-12 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
HF625-0.005-00-80 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
BP100-0.008-00-27 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
SPA2000-0.015-00-115 | Bergquist Company | 3,000 | Thermal Interface Products High Reliability Insulator, 0.015 Inch Thick, Sil-Pad TSP A3000/Sil-Pad A2000 |
SP980-0.009-00-40 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980 |
Q3-0.005-AC-115 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
SP1100ST-0.012-02-25 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
SPA2000-0.015-AC-30 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.015 Inch Thick, 1 Side Adhesive, Sil-Pad TSP A3000/Sil-Pad A2000 |
SP400-0.007-00-13 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |