210-88-306-41-001000 - Mill-Max

IC & Component Sockets STANDRD SOLDER TAIL DIP SOCKET

XC2C256-6VQG100C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
XC2C256-6TQG144C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
XC9536XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
XC2C32A-6VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
XC9572XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
XC9572XL-10VQG64C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44I

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
SPEAR300-2

STMicroelectronics

Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
XC2C512-10FT256I

STMicroelectronics

Embedded - CPLDs (Complex Programmable Logic Devices)

Part	Manufacturer	Stock	Description
HSE-B18254-035H	CUI Devices	401	Heat Sinks 25.4x41.6x25mm w/pin extrusion TO-218
HAF10L	TDK-Lambda	33	Heat Sinks Heatsk 116.8x25.4x61 For PFE Series
271-AB	Wakefield-Vette	749	Heat Sinks HEAT SINK TO-220 TOP MNT BLK
262-75ABE375	Wakefield-Vette	1,711	Heat Sinks Vertical Mount Heat Sink for Power Semiconductor TO-220/TO-262, Aluminum, Black Anodized, Solderable Tab
902-21-2-23-2-B-0	Wakefield-Vette	106	Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 21mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
C60-075-VE	Ohmite	9	Heat Sinks HEATSINK TO247 TO264
241409B91200G	Aavid, Thermal Division of Boyd Corporation	49	Heat Sinks Heat Sink for Quarter Brick DC/DC Converters, Lengthwise Fins, 22.9mm Height
HSS-B20-NP	CUI Devices	267	Heat Sinks 38.1 x 12.8 x 12.7mm TO-220 slide in
HAH10T	TDK-Lambda	38	Heat Sinks Heat Sinks
RHS10067D	Carlo Gavazzi	6	Heat Sinks H/S SSR 1-PH X1 PANEL 121X76X67MM + SRW
630-60AB	Wakefield-Vette	11	Heat Sinks Omnidirectional Pin Fin Heat Sink for 35mm BGA, 35x16.5mm
WAVE-23-125	Wakefield-Vette	624	Heat Sinks Low Profile Heat Sink BGA Chipset Aluminum Top Mount
901-19-1-23-2-B-0	Wakefield-Vette	180	Heat Sinks Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
511-3M	Wakefield-Vette	15	Heat Sinks High Fin Density Heat Sinks for Power Modules, IGBTs & Relays
HSS-B20-0635H	CUI Devices	259	Heat Sinks 19.05 x 13.21x6.35mm TO-220 solder pin