sales@szcinty.com
Product overview
- Part Number
- 1210Y0100183FCT
- Manufacturer
- Syfer / Knowles
- Product Category
- Multilayer Ceramic Capacitors MLCC - SMD/SMT
- Description
- Multilayer Ceramic Capacitors MLCC - SMD/SMT
Documents & Media
- Datasheets
- 1210Y0100183FCT
Product Attributes
- Capacitance :
- 0.018 uF
- Case Code - in :
- 1210
- Case Code - mm :
- 3225
- Dielectric :
- C0G (NP0)
- Height :
- 2 mm
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Product :
- General Type MLCCs
- Termination :
- Flexible (Soft)
- Termination Style :
- SMD/SMT
- Tolerance :
- 1 %
- Voltage Rating DC :
- 10 VDC
Description
Multilayer Ceramic Capacitors MLCC - SMD/SMT
Price & Procurement
Associated Product
You May Also Be Interested In
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| SP1200-0.016-AC-132 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.016 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
| HF300P-0.002-00-114 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| BP100-0.008-00-138 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| SP1200-0.009-AC-61 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
| HF300P-0.002-00-73 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| BP100-0.008-00-47 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| BP100-0.011-00-19 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| SPA1500-0.010-00-66 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.010 Inch Thick, Sil-Pad TSP A2000/Sil-Pad A1500 |
| BP100-0.008-00-136 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| SP1200-0.016-AC-44 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.016 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
| SP400-0.009-AC-95 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
| HF650P-0.002-01-66 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| SP1500ST-0.008-02-117 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.008 Inch Thick, Sil-Pad TSP 1800ST/Sil-Pad 1500ST |
| SP900S-0.009-AC-81 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600S/Sil-Pad 900S |
| HF300P-0.002-00-110 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
