Product overview

Part Number
CAN21C272KAGAC7210
Manufacturer
KEMET Electronics
Product Category
Multilayer Ceramic Capacitors MLCC - SMD/SMT
Description
Multilayer Ceramic Capacitors MLCC - SMD/SMT 250VAC 2700pF 10% C0G 2220 Non-Safety

Documents & Media

Product Attributes

Capacitance :
2700 pF
Case Code - in :
2220
Case Code - mm :
5650
Dielectric :
C0G (NP0)
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Packaging :
Reel
Product :
General Type MLCCs
Series :
CAN SMD Indust C0G
Termination :
Standard
Termination Style :
SMD/SMT
Tolerance :
10 %
Voltage Rating DC :
-

Description

Multilayer Ceramic Capacitors MLCC - SMD/SMT 250VAC 2700pF 10% C0G 2220 Non-Safety

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

You May Also Be Interested In

Part Manufacturer Stock Description
44025-0000-99-0ACT Kontron 3,000 Heat Sinks pITX-APL active Cooler
18099-0000-99-0 Kontron 3,000 Heat Sinks ETX Universal Active Cooler for Heatspreader Mounting
THS-cWL-B ADLINK Technology 3,000 Heat Sinks Low profile heatsink for cExpress-WL with threaded standoffs for bottom mounting
HTS-cBT-BT ADLINK Technology 3,000 Heat Sinks Heatspreader for cExpress-BT with through hole standoffs for top mounting
conga-B7AC/HSP-Cu-B congatec 3,000 Heat Sinks Standard heatspreader for COM Express Basic Type 7 module conga-B7AC with integrated copper plate. * Cu = Copper plate * B = Bore hole standoffs
conga-TS170/CSP-HP-T congatec 3,000 Heat Sinks Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.
THSHP-104X-ATIE4690 ADLINK Technology 3,000 Heat Sinks HEAT SINK HEAT PIPE FOR 104X-ATIE4690
FXXCA78X108HS Intel 3,000 Heat Sinks Spare Heat sink 78mmx108mm 49 fins for 1U/2U Chassis
CMx-SLx-TM-10 ADLINK Technology 3,000 Heat Sinks CMx-SLx Passive Heat Sink (0C to +60C)
657-20ABPNE Wakefield-Vette 3,000 Heat Sinks High Performance Heat Sink for Vertical Board Mounting TO-220, TO-227, TO-218
677-25ABPE Wakefield-Vette 3,000 Heat Sinks High Performance, High Power Heat Sink for Vertical Board Mounting for TO-220, TO-247, TO-218, 15-LEAD MULTIWATT, 63.5mm Height
960-31-33-F-AB-0 Wakefield-Vette 3,000 Heat Sinks HEATSINK 31X33MM FRONT PLASTIC PUSH PIN
19756-M-AB Wakefield-Vette 3,000 Heat Sinks Radial Fin Heat Sink for LED
C264-085-3VE Ohmite 3,000 Heat Sinks HEATSINK FOR TO-264 3 CLIPS, NO FINISH
TXB2P-032-037CB CTS Electronic Components 3,000 Heat Sinks