182-10-950-00-001000 - Mill-Max

Headers & Wire Housings 50P DIP SOLDER CUP HDR 2 LEVEL WRAPOST

XC2C256-6VQG100C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
XC2C256-6TQG144C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
XC9536XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
XC2C32A-6VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
XC9572XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
XC9572XL-10VQG64C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44I

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
SPEAR300-2

STMicroelectronics

Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
XC2C512-10FT256I

STMicroelectronics

Embedded - CPLDs (Complex Programmable Logic Devices)

Part	Manufacturer	Stock	Description
GS8160Z18DGT-250	GSI Technology	3,000	SRAM 2.5 or 3.3V 1M x 18 18M
GS8161E18DGT-250	GSI Technology	3,000	SRAM 2.5 or 3.3V 1M x 18 18M
GS816132DGT-250	GSI Technology	3,000	SRAM 2.5 or 3.3V 512K x 32 16M
GS8160E32DGT-250	GSI Technology	3,000	SRAM 2.5 or 3.3V 512K x 32 16M
GS8161E36DGD-200	GSI Technology	3,000	SRAM 2.5 or 3.3V 512K x 36 18M
GS8162Z36DGB-200	GSI Technology	3,000	SRAM 2.5 or 3.3V 512K x 36 18M
GS8162Z18DGB-150	GSI Technology	3,000	SRAM 2.5 or 3.3V 1M x 18 18M
GS816132DGD-150	GSI Technology	3,000	SRAM 2.5 or 3.3V 512K x 32 16M
GS8161E36DD-150	GSI Technology	3,000	SRAM 2.5 or 3.3V 512K x 36 18M
GS816136DGD-150	GSI Technology	3,000	SRAM 2.5 or 3.3V 512K x 36 18M
GS816218DGD-200	GSI Technology	3,000	SRAM 2.5 or 3.3V 1M x 18 18M
GS816236DGB-150	GSI Technology	3,000	SRAM 2.5 or 3.3V 512K x 36 18M
GS8161E36DD-200	GSI Technology	3,000	SRAM 2.5 or 3.3V 512K x 36 18M
GS816236DGD-150	GSI Technology	3,000	SRAM 2.5 or 3.3V 512K x 36 18M
GS816218DGD-150	GSI Technology	3,000	SRAM 2.5 or 3.3V 1M x 18 18M