Product overview
- Part Number
- 1210B223K250CT
- Manufacturer
- Walsin
- Product Category
- Multilayer Ceramic Capacitors MLCC - SMD/SMT
- Description
- Multilayer Ceramic Capacitors MLCC - SMD/SMT 1210 MLCC X7R 0.022 uF +/- 10% 25 V T&R GP
Documents & Media
- Datasheets
- 1210B223K250CT
Product Attributes
- Capacitance :
- 0.022 uF
- Case Code - in :
- 1210
- Case Code - mm :
- 3225
- Dielectric :
- X7R
- Height :
- 0.8 mm
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Cut Tape, MouseReel, Reel
- Product :
- General Type MLCCs
- Termination :
- Standard
- Termination Style :
- SMD/SMT
- Tolerance :
- 10 %
- Voltage Rating DC :
- 25 VDC
Description
Multilayer Ceramic Capacitors MLCC - SMD/SMT 1210 MLCC X7R 0.022 uF +/- 10% 25 V T&R GP
Price & Procurement
Associated Product
You May Also Be Interested In
Part | Manufacturer | Stock | Description |
---|---|---|---|
SP980-0.009-00-130 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980 |
HF300P-0.002-00-42 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
PPK10-0.006-AC-20 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK1300/Poly-Pad K-10 |
SP400-0.007-AC-95 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
SP1200-0.012-00-55 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.012 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |
PPK4-0.006-00-38 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
SP980-0.009-AC-126 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1680/Sil-Pad 980 |
BP100-0.008-00-137 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
SP800-0.005-AC-95 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
SP980-0.009-AC-121 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1680/Sil-Pad 980 |
BP100-0.011-00-20 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
SP1200-0.016-AC-45 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.016 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
SP1200-0.016-00-64 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.016 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |
SP1200-0.016-AC-132 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.016 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
HF300P-0.002-00-114 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |