Product overview

Part Number
801-13-027-10-007000
Manufacturer
Mill-Max
Product Category
Headers & Wire Housings
Description
Headers & Wire Housings 27P,1R FML,20-18AWG 4.5A,SOLDERCUP STRIP

Documents & Media

Product Attributes

Contact Gender :
Socket (Female)
Contact Plating :
Gold
Mounting Angle :
Straight
Mounting Style :
-
Number of Positions :
27 Position
Number of Rows :
1 Row
Packaging :
Bulk
Pitch :
2.54 mm
Product :
Headers
Row Spacing :
2.54 mm
Series :
0801
Termination Style :
Solder Cup
Type :
Socket
Wire Gauge :
20 AWG to 18 AWG

Description

Headers & Wire Housings 27P,1R FML,20-18AWG 4.5A,SOLDERCUP STRIP

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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