Product overview

Part Number
1-521766-2
Manufacturer
TE Connectivity
Product Category
Headers & Wire Housings
Description
Headers & Wire Housings PL MKIII 250 REC HSG 2P

Documents & Media

Datasheets
1-521766-2

Product Attributes

Contact Plating :
Nickel
Maximum Operating Temperature :
+ 130 C
Minimum Operating Temperature :
- 40 C
Mounting Angle :
Straight
Mounting Style :
Cable Mount / Free Hanging
Number of Positions :
2 Position
Pitch :
10.8 mm
Product :
Wire Housings
Termination Style :
Crimp
Type :
Receptacle Housing

Description

Headers & Wire Housings PL MKIII 250 REC HSG 2P

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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