Product overview

Part Number
68669-007LF
Manufacturer
Amphenol FCI
Product Category
Headers & Wire Housings
Description
Headers & Wire Housings 18P R/A SHLDED HDR

Documents & Media

Datasheets
68669-007LF

Product Attributes

Contact Plating :
Gold
Mounting Angle :
Right Angle
Mounting Style :
-
Number of Positions :
18 Position
Number of Rows :
1 Row
Packaging :
Tray
Pitch :
2.54 mm
Product :
Headers
Series :
BergCon
Termination Style :
Solder Pin
Type :
Shrouded

Description

Headers & Wire Housings 18P R/A SHLDED HDR

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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