Product overview

Part Number
5-103961-4
Manufacturer
TE Connectivity
Product Category
Headers & Wire Housings
Description
Headers & Wire Housings HSG&REC 1X05C P/L 30-26 AWG

Documents & Media

Datasheets
5-103961-4

Product Attributes

Contact Gender :
Socket (Female)
Contact Plating :
Gold
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 65 C
Mounting Style :
Cable Mount / Free Hanging
Number of Positions :
5 Position
Number of Rows :
1 Row
Packaging :
Tube
Pitch :
2.54 mm
Product :
Wire Housings
Row Spacing :
2.54 mm
Series :
AMPMODU MTE
Termination Style :
Crimp
Tradename :
AMPMODU
Type :
Latch / Eject
Wire Gauge :
30 AWG to 26 AWG

Description

Headers & Wire Housings HSG&REC 1X05C P/L 30-26 AWG

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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