sales@szcinty.com
Product overview
- Part Number
- DTS20H09-35PC
- Manufacturer
- TE Connectivity / DEUTSCH
- Product Category
- Circular MIL Spec Connector
- Description
- Circular MIL Spec Connector HERM RECP
Documents & Media
- Datasheets
- DTS20H09-35PC
Product Attributes
- Contact Gender :
- Pin (Male)
- Contact Material :
- Copper Alloy
- Contact Plating :
- Gold
- Current Rating :
- 5 A
- Insert Arrangement :
- 09-35
- MIL Type :
- MIL-DTL-38999 III
- Mounting Style :
- Panel
- Number of Positions :
- 6 Position
- Product :
- Receptacles
- Shell Size :
- 9
- Shell Style :
- Square Flange
- Termination Style :
- Solder
Description
Circular MIL Spec Connector HERM RECP
Price & Procurement
Associated Product
You May Also Be Interested In
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| SP900S-0.009-00-101 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1600S/Sil-Pad 900S |
| SP800-0.005-00-56 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
| PP400-0.009-00-17 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400 |
| SP1100ST-0.012-02-81 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
| HF650P-0.001-01-2 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| QII-0.006-00-76 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP Q2500/Q-Pad II, Q2-76, BG40860 |
| HF650P-0.002-01-62 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| Q3-0.005-00-53 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3 |
| SPK6-0.006-00-105 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6 |
| Q3-0.005-00-102 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3 |
| HF300P-0.0015-00-11 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| SP1200-0.009-00-43 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |
| Q3-0.005-00-96 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3 |
| SP1200-0.009-AC-19 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
| PP400-0.009-00-43 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400 |
