sales@szcinty.com
Product overview
- Part Number
- TSW-136-10-S-D-RA
- Manufacturer
- Samtec
- Product Category
- Headers & Wire Housings
- Description
- Headers & Wire Housings Classic PCB Header Strips, 0.100 pitch
Documents & Media
- Datasheets
- TSW-136-10-S-D-RA
Product Attributes
- Contact Gender :
- Pin (Male)
- Contact Plating :
- Gold
- Mating Post Length :
- 5.84 mm
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Right Angle
- Mounting Style :
- Through Hole
- Number of Positions :
- 72 Position
- Number of Rows :
- 2 Row
- Packaging :
- Bulk
- Pitch :
- 2.54 mm
- Product :
- Headers
- Row Spacing :
- 2.54 mm
- Series :
- TSW
- Termination Post Length :
- 9.91 mm
- Termination Style :
- Solder Pin
Description
Headers & Wire Housings Classic PCB Header Strips, 0.100 pitch
Price & Procurement
Associated Product
You May Also Be Interested In
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| PM5334A-FEI | Microsemi / Microchip | 3,000 | Telecom Interface ICs Single-chip SONET/SDH Transport Framer Product Brief |
| CMX602BD4-REEL | CML Microcircuits | 3,000 | Telecom Interface ICs |
| CMX602BE4-REEL | CML Microcircuits | 3,000 | Telecom Interface ICs |
| PM5338-FEI | Microsemi / Microchip | 3,000 | Telecom Interface ICs Single Chip Add/Drop Multiplexer with PDH client interfaces |
| PM5320-NGI | Microsemi / Microchip | 3,000 | Telecom Interface ICs SONET/SDH Interface for 622 & 155 Mbit/s |
| PM8312-PGI | Microsemi / Microchip | 3,000 | Telecom Interface ICs 32Channel T1/E1 Framer Device with Integrated VT1.5/VT2 Mappers and M13 Multiplexer for 1 DS3/E3 |
| PM4332-PGI | Microsemi / Microchip | 3,000 | Telecom Interface ICs 32 Channel T1/E1 Framer |
| CMX631AD4-REEL | CML Microcircuits | 3,000 | Telecom Interface ICs |
| PM5324-FEI | Microsemi / Microchip | 3,000 | Telecom Interface ICs PM5324: ARROW-1x192 |
| PM8311A-FEI | Microsemi / Microchip | 3,000 | Telecom Interface ICs TEMUX 168 Pb Free |
| PM8321-PGI | Microsemi / Microchip | 3,000 | Telecom Interface ICs High Density Framer/Mapper for 84 T1's or 63 E1's |
| PM8324-FEI | Microsemi / Microchip | 3,000 | Telecom Interface ICs TEMAP 84FDL Green Dual Passivation LFUBM |
| VSC9295XSM | Microsemi / Microchip | 3,000 | Telecom Interface ICs 340 Gbps 136x136 SONET/SDH TSI Switch Pb-free |
| PM5376-FEI | Microsemi / Microchip | 3,000 | Telecom Interface ICs TSE-Nx160 |
| PM5326-FEI | Microsemi / Microchip | 3,000 | Telecom Interface ICs ARROW-2x192 |
