sales@szcinty.com
Product overview
- Part Number
- TSW-111-18-T-S
- Manufacturer
- Samtec
- Product Category
- Headers & Wire Housings
- Description
- Headers & Wire Housings Classic PCB Header Strips, 0.100 pitch
Documents & Media
- Datasheets
- TSW-111-18-T-S
Product Attributes
- Contact Gender :
- Pin (Male)
- Contact Plating :
- Tin
- Mating Post Length :
- 18.29 mm
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Mounting Style :
- Through Hole
- Number of Positions :
- 11 Position
- Number of Rows :
- 1 Row
- Packaging :
- Bulk
- Pitch :
- 2.54 mm
- Product :
- Headers
- Series :
- TSW
- Termination Post Length :
- 2.79 mm
- Termination Style :
- Solder Pin
Description
Headers & Wire Housings Classic PCB Header Strips, 0.100 pitch
Price & Procurement
Associated Product
You May Also Be Interested In
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| HF625-0.005-AC-84 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
| SPK4-0.006-00-93 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
| PP400-0.009-00-112 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400 |
| SP1100ST-0.012-02-50 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
| BP100-0.008-00-90 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| HF625-0.005-AC-25 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
| HF650P-0.001-01-136 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| HF625-0.005-AC-48 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
| SP1100ST-0.012-02-33 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
| HF625-0.005-AC-65 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
| BP100-0.008-00-77 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| HF650P-0.0015-01-70 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| SP400-0.007-AC-46 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007" Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400, PN0010127 |
| SP1100ST-0.012-02-9 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
| SP400-0.007-AC-80 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
