Product overview

Part Number
172256-1103
Manufacturer
Molex
Product Category
Headers & Wire Housings
Description
Headers & Wire Housings UltraFit TPA REC HSG 3.50MM S/R 3CIR BLK

Documents & Media

Datasheets
172256-1103

Product Attributes

Application :
Power, Wire to Board
Contact Gender :
-
Contact Plating :
-
Maximum Operating Temperature :
+ 120 C
Minimum Operating Temperature :
- 40 C
Mounting Angle :
Straight
Mounting Style :
Cable Mount / Free Hanging
Number of Positions :
3 Position
Number of Rows :
1 Row
Packaging :
Bulk
Pitch :
3.5 mm
Product :
Wire Housings
Row Spacing :
-
Series :
172256
Termination Style :
Crimp
Tradename :
Ultra-Fit
Type :
Receptacle Housing

Description

Headers & Wire Housings UltraFit TPA REC HSG 3.50MM S/R 3CIR BLK

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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