Product overview

Part Number
504449-1307
Manufacturer
Molex
Product Category
Headers & Wire Housings
Description
Headers & Wire Housings 1.0 WB 1 ROW ST WAFER 13Ckt

Documents & Media

Datasheets
504449-1307

Product Attributes

Application :
Wire-to-Board
Contact Gender :
Pin (Male)
Contact Plating :
Gold
Maximum Operating Temperature :
+ 85 C
Minimum Operating Temperature :
- 40 C
Mounting Angle :
Straight
Mounting Style :
SMD/SMT
Number of Positions :
13 Position
Number of Rows :
1 Row
Packaging :
Cut Tape, Reel
Pitch :
1 mm
Product :
Headers
Series :
504449
Termination Style :
Solder
Tradename :
Pico-Clasp
Type :
Shrouded

Description

Headers & Wire Housings 1.0 WB 1 ROW ST WAFER 13Ckt

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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