Product overview

Part Number
3-2366515-2
Manufacturer
TE Connectivity
Product Category
Headers & Wire Housings
Description
Headers & Wire Housings DYNAMIC D1000 SLIM REC HSG 12P X KEY

Documents & Media

Datasheets
3-2366515-2

Product Attributes

Application :
Power and Signal
Contact Gender :
Socket (Female)
Contact Plating :
Gold
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Straight
Mounting Style :
Cable Mount / Free Hanging
Number of Positions :
12 Position
Number of Rows :
4 Row
Pitch :
2 mm
Product :
Wire Housings
Row Spacing :
2 mm
Termination Style :
Crimp
Type :
Wire-to-Wire

Description

Headers & Wire Housings DYNAMIC D1000 SLIM REC HSG 12P X KEY

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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