Product overview

Part Number
SEAMP-30-02.0-L-08
Manufacturer
Samtec
Product Category
Board to Board & Mezzanine Connectors
Description
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit

Documents & Media

Product Attributes

Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
2.5 A
Housing Material :
Nylon
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Straight
Number of Positions :
240 Position
Number of Rows :
8 Row
Packaging :
Tray
Pitch :
1.27 mm
Product :
Headers
Series :
SEAMP
Termination Style :
Solder
Voltage Rating :
215 V

Description

Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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