Product overview

Part Number
471-2025-100
Manufacturer
Amphenol TCS
Product Category
Board to Board & Mezzanine Connectors
Description
Board to Board & Mezzanine Connectors 200P NeXLev Plug 380 Solder Balls

Documents & Media

Datasheets
471-2025-100

Product Attributes

Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
1 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 40 C
Mounting Angle :
Vertical
Number of Positions :
200 Position
Number of Rows :
20 Row
Packaging :
Tray
Pitch :
1.15 mm
Product :
Plugs
Series :
NeXLev
Stack Height :
10 mm, 13 mm, 18 mm, 23 mm, 26 mm
Termination Style :
BGA
Voltage Rating :
600 V

Description

Board to Board & Mezzanine Connectors 200P NeXLev Plug 380 Solder Balls

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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