Product overview
- Part Number
- HDWM-03-52-G-S-260
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors .050" X .100" Flex Stack, High-Temp Micro Board Stacker
Documents & Media
- Datasheets
- HDWM-03-52-G-S-260
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Positions :
- 3 Position
- Number of Rows :
- 1 Row
- Pitch :
- 1.27 mm
- Product :
- Headers
- Series :
- HDWM
- Termination Style :
- Solder Pin
Description
Board to Board & Mezzanine Connectors .050" X .100" Flex Stack, High-Temp Micro Board Stacker
Price & Procurement
Associated Product
You May Also Be Interested In
Part | Manufacturer | Stock | Description |
---|---|---|---|
MT29F4G08ABAEAWP-IT:E TR | Micron | 999 | NAND Flash SLC 4G 512MX8 TSOP |
MT29F4G16ABADAH4-AIT:D TR | Micron | 1,518 | NAND Flash SLC 4G 256MX16 FBGA |
MT29F2G08ABAGAWP-IT:G TR | Micron | 2,999 | NAND Flash SLC 2G 256MX8 TSOP |
MT29F2G08ABBGAH4-IT:G TR | Micron | 4,628 | NAND Flash SLC 2G 256MX8 FBGA |
MT29F2G08ABAEAWP-AATX:E TR | Micron | 600 | NAND Flash SLC 2G 256MX8 TSOP |
AS5F32G04SND-08LIN | Alliance Memory | 432 | NAND Flash |
MT29F4G08ABBDAH4:D TR | Micron | 604 | NAND Flash SLC 4G 512MX8 FBGA |
MT29F1G08ABAFAWP-ITE:F TR | Micron | 1,749 | NAND Flash SLC 1G 128MX8 TSOP |
MT29F1G08ABAEAWP:E TR | Micron | 885 | NAND Flash SLC 1G 128MX8 TSOP |
MT29F16G08ABCBBH1-12AIT:B TR | Micron | 553 | NAND Flash SLC 16G 2GX8 VBGA |
AS5F31G04SND-08LIN | Alliance Memory | 312 | NAND Flash |
MT29F8G08ABBCAH4-IT:C TR | Micron | 1,685 | NAND Flash SLC 8G 1GX8 FBGA |
MT29F4G16ABBDAH4-IT:D TR | Micron | 935 | NAND Flash SLC 4G 256MX16 FBGA |
MT29F2G08ABBEAHC-IT:E TR | Micron | 633 | NAND Flash SLC 2G 256MX8 FBGA |
MT29F4G08ABAEAWP:E TR | Micron | 995 | NAND Flash SLC 4G 512MX8 TSOP |