Product overview

Part Number
470-3075-600
Manufacturer
Amphenol TCS
Product Category
Board to Board & Mezzanine Connectors
Description
Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls

Documents & Media

Datasheets
470-3075-600

Product Attributes

Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
1 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Data Rate :
12.5 Gb/s
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 40 C
Mounting Angle :
Vertical
Number of Positions :
300 Position
Number of Rows :
30 Row
Packaging :
Tray
Pitch :
1.15 mm
Product :
Receptacles
Series :
NeXLev
Stack Height :
10 mm, 12 mm, 14 mm, 17 mm
Termination Style :
BGA
Voltage Rating :
600 V

Description

Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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