sales@szcinty.com
Product overview
- Part Number
- TW-16-06-T-D-300-150
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Documents & Media
- Datasheets
- TW-16-06-T-D-300-150
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Tin
- Current Rating :
- 5.2 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 32 Position
- Number of Rows :
- 2 Row
- Packaging :
- Bulk
- Pitch :
- 2 mm
- Product :
- Headers
- Series :
- TW
- Stack Height :
- 7.62 mm
- Termination Style :
- Solder Pin
Description
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Price & Procurement
Associated Product
You May Also Be Interested In
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| HS-0660-F2-NT | Arbor Technology | 3,000 | Heat Sinks Heat Spreader (84*55*11mm) w/o THREADED for EmNANO-i2300/NAO-660E |
| HS-56M0-F1 | Arbor Technology | 3,000 | Heat Sinks Heatspreader for EmNANO-a56M0 |
| HS-2309-F2-NT | Arbor Technology | 3,000 | Heat Sinks Heat Spreader (95*95*11mm) w/o TAPPING for EmETXe-i2309/i2309-WT |
| HS-55E0-F2 | Arbor Technology | 3,000 | Heat Sinks Heat Spreader (114*95*8mm) for EmETX-a55E0 |
| HS-0660-F2-T | Arbor Technology | 3,000 | Heat Sinks Heat Spreader (84*55*11mm) for EmNANO-i2300/NAO-660E |
| HS-2700-F1 | Arbor Technology | 3,000 | Heat Sinks Heat Spreader (114*95*9mm) for EmETX-i2700 |
| HS-75E0-F2 | Arbor Technology | 3,000 | Heat Sinks Heatspreader for EmETXe-a75E0 |
| HS-88U0-F2-NT | Arbor Technology | 3,000 | Heat Sinks Heat spreader (95*95*11mm) without threaded standoffs for EmETXe-i87U2/i88U0 |
| HS-0842-F1 | Arbor Technology | 3,000 | Heat Sinks Heat Spreader (125*95*20.8mm) for COM-842E/L7500 |
| HS-2905-F1-KIT | Arbor Technology | 3,000 | Heat Sinks Heat Spreader Kit (125*95*18mm) for EmETXe-i2905 |
| HS-0662-F1 | Arbor Technology | 3,000 | Heat Sinks Heat Spreader (70*65*8mm) for EmQ-i2301 / QSM-662E |
| HS-0000-W1 | Arbor Technology | 3,000 | Heat Sinks Heatsink with fins for COMe/ETX/XTX |
| HS-65M2-F2 | Arbor Technology | 3,000 | Heat Sinks Heat Spreader (95*95*11mm) for EmETXe-i65M2/i67M2/i77M2 & COM-870E |
| HS-58M0-F2-NT | Arbor Technology | 3,000 | Heat Sinks Heat spreader (95*95*11mm) without threaded standoffs for EmETXe-a58M0 |
| HS-2506-C1 | Arbor Technology | 3,000 | Heat Sinks Heatspreader for EmQ-i2506 |
