Product overview

Part Number
TW-04-03-G-D-250-150
Manufacturer
Samtec
Product Category
Board to Board & Mezzanine Connectors
Description
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch

Documents & Media

Product Attributes

Contact Material :
Phosphor Bronze
Contact Plating :
Gold
Current Rating :
5.2 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Data Rate :
8 Gbps
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Vertical
Number of Positions :
8 Position
Number of Rows :
2 Row
Packaging :
Bulk
Pitch :
2 mm
Product :
Headers
Series :
TW
Stack Height :
6.35 mm
Termination Style :
Solder Pin

Description

Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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