Product overview

Part Number
LPAM-40-01.5-L-08-2-K-TR
Manufacturer
Samtec
Product Category
Board to Board & Mezzanine Connectors
Description
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

Documents & Media

Product Attributes

Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
2.2 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Data Rate :
28 Gbps
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Vertical
Number of Positions :
320 Position
Number of Rows :
8 Row
Packaging :
Cut Tape, Reel
Pitch :
1.27 mm
Product :
Headers
Series :
LPAM
Stack Height :
4.5 mm, 5 mm
Termination Style :
Crimp
Voltage Rating :
250 VAC

Description

Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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