Product overview

Part Number
ASP-134604-04
Manufacturer
Samtec
Product Category
Board to Board & Mezzanine Connectors
Description
Board to Board & Mezzanine Connectors

Documents & Media

Datasheets
ASP-134604-04

Product Attributes

Contact Material :
Copper Alloy
Contact Plating :
Gold
Housing Material :
Liquid Crystal Polymer (LCP)
Mounting Angle :
Vertical
Number of Positions :
160 Position
Number of Rows :
4 Row
Packaging :
Cut Tape, Reel
Pitch :
1.27 mm
Product :
Headers
Termination Style :
Solder Balls

Description

Board to Board & Mezzanine Connectors

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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