Product overview

Part Number
505070-0622
Manufacturer
Molex
Product Category
Board to Board & Mezzanine Connectors
Description
Board to Board & Mezzanine Connectors SlimStack .35mm Conn Plg 6Ckt Armor Nail

Documents & Media

Datasheets
505070-0622

Product Attributes

Contact Material :
Copper
Contact Plating :
Gold
Current Rating :
300 mA
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 85 C
Minimum Operating Temperature :
- 40 C
Mounting Angle :
Vertical
Number of Positions :
6 Position
Number of Rows :
2 Row
Packaging :
Cut Tape, MouseReel, Reel
Pitch :
0.35 mm
Product :
Headers
Series :
505070
Stack Height :
0.6 mm, 0.7 mm
Termination Style :
Solder
Voltage Rating :
50 V

Description

Board to Board & Mezzanine Connectors SlimStack .35mm Conn Plg 6Ckt Armor Nail

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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