- Manufacturer：
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- CUI Devices (1)
- Ohmite (4)
- Trenz Electronic (1)
- Mounting Style：
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- Height：
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- Designed for：
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- Heatsink Material：
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- Fin Style：
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- Thermal Resistance：
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- Selected conditions：
38 Records
| Image | Part Number | Manufacturer | Description | Availability |
Online Service
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|---|---|---|---|---|---|
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CUI Devices | Heat Sinks heat sink, stamping, TO-220, 31 x 25.25 |
2,498 In stock
|
Get Quote | |
|
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Advanced Thermal Solutions | Heat Sinks BGA fanSINK Assembly with maxiGRIP ... |
30 In stock
|
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|
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Advanced Thermal Solutions | Heat Sinks maxiGRIP Assemblies for Attachment of HS... |
341 In stock
|
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|
|
Trenz Electronic | Heat Sinks Heat Sink for Trenz Electronic MPSoC M... |
14 In stock
|
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|
|
Advanced Thermal Solutions | Heat Sinks maxiFLOW Heat Sink , Double-Sided Ther... |
266 In stock
|
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|
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Advanced Thermal Solutions | Heat Sinks maxiFLOW maxiGRIP HS Assembly- LP,... |
200 In stock
|
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|
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Advanced Thermal Solutions | Heat Sinks maxiFLOW maxiGRIP HS Assembly- STD... |
199 In stock
|
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|
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Advanced Thermal Solutions | Heat Sinks maxiFLOW superGRIP HS Assembly- ST... |
200 In stock
|
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|
|
Advanced Thermal Solutions | Heat Sinks maxiFLOW superGRIP HS Assembly- ST... |
100 In stock
|
Get Quote | |
|
|
Advanced Thermal Solutions | Heat Sinks fanSINK Assembly w/ maxiGRIP Attachme... |
142 In stock
|
Get Quote |
