rfq@cintymcu.com
Resumo do Produto
- Número da peça
- 767141431GP
- Fabricante
- CTS Electronic Components
- Categoria de Produto
- Redes e matrizes de resistores
- Descrição
- Resistor Networks & Arrays BUSSED STD 100K
Documentos e mídia
- Folhas de dados
- 767141431GP
Atributos do produto
- Circuit Type :
- Bussed
- Height :
- 1.4 mm
- Length :
- 9.91 mm
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Number of Pins :
- 14
- Packaging :
- Bulk
- Resistor Values :
- 430 Ohms
- Series :
- 767
- Temperature Coefficient :
- 100 PPM / C
- Termination Style :
- SMD/SMT
- Tolerance :
- 2 %
- Width :
- 5.59 mm
Descrição
Resistor Networks & Arrays BUSSED STD 100K
Preço e Aquisição
Produto Associado
Você também pode estar interessado em
| Papel | Fabricante | Estoque | Descrição |
|---|---|---|---|
| PPK4-0.006-00-30 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| SP800-0.005-AC-27 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
| HF625-0.005-AC-114 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
| PPK10-0.006-00-85 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK1300/Poly-Pad K-10 |
| SP400-0.007-00-84 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
| HF300P-0.0015-00-111 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| SP1100ST-0.012-02-26 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
| SP1100ST-0.012-02-20 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
| PPK4-0.006-00-131 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| SP2000-0.010-00-12 | Bergquist Company | 3,000 | Thermal Interface Products High Reliability Insulator, 0.010 Inch Thick, Sil-Pad TSP 3500/Sil-Pad 2000 |
| SP900S-0.009-00-53 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1600S/Sil-Pad 900S, BG425273, IDH 2190962 |
| HF300P-0.001-00-13 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| PPK4-0.006-AC-119 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| HF300P-0.001-00-19 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| HF625-0.005-AC-4 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
