Resumo do Produto

Número da peça
CLP-116-02-F-D-A
Fabricante
Samtec
Categoria de Produto
Conectores de placa a placa e mezanino
Descrição
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch

Documentos e mídia

Folhas de dados
CLP-116-02-F-D-A

Atributos do produto

Contact Material :
Phosphor Bronze
Contact Plating :
Gold
Current Rating :
3.4 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Data Rate :
8 Gbps
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Vertical
Number of Positions :
32 Position
Number of Rows :
2 Row
Packaging :
Tube
Pitch :
1.27 mm
Product :
Sockets
Series :
CLP
Termination Style :
Solder Pin
Voltage Rating :
280 VAC, 395 VDC

Descrição

Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch

Preço e Aquisição

Produto Associado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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