Resumo do Produto
- Número da peça
- TW-08-03-F-S-300-090
- Fabricante
- Samtec
- Categoria de Produto
- Conectores de placa a placa e mezanino
- Descrição
- Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Documentos e mídia
- Folhas de dados
- TW-08-03-F-S-300-090
Atributos do produto
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 5.2 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 8 Position
- Number of Rows :
- 1 Row
- Packaging :
- Bulk
- Pitch :
- 2 mm
- Product :
- Headers
- Series :
- TW
- Stack Height :
- 7.62 mm
- Termination Style :
- Solder Pin
Descrição
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Preço e Aquisição
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