Descripción del producto

Número de parte
ATS-54170R-C1-R0
Fabricante
Advanced Thermal Solutions
categoria de producto
Disipadores de calor
Descripción
Heat Sinks High Performance Extrusion, Double-Sided Thermal Tape, Black-Anodized

Documentos y Medios

Hojas de datos
ATS-54170R-C1-R0

Atributos del producto

Designed for :
BGA
Heatsink Material :
Aluminum
Height :
19.5 mm
Length :
17 mm
Mounting Style :
Adhesive
Product :
Heat Sinks
Thermal Resistance :
9.3 C/W
Width :
17 mm

Descripción

Heat Sinks High Performance Extrusion, Double-Sided Thermal Tape, Black-Anodized

Precio y Adquisiciones

Producto asociado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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