Descripción del producto

Número de parte
ALAN-508-T
Fabricante
Abracon
categoria de producto
Transformadores de audio / Transformadores de señal
Descripción
Audio Transformers / Signal Transformers PULSE XFMR 1CT:1CT 350UH

Documentos y Medios

Hojas de datos
ALAN-508-T

Atributos del producto

Application :
10/100 Base-T PoE
Number of Channels :
Single
Packaging :
Reel
Product :
PoE Transformers
Series :
508
Type :
Module

Descripción

Audio Transformers / Signal Transformers PULSE XFMR 1CT:1CT 350UH

Precio y Adquisiciones

Producto asociado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Usted también podría estar interesado en

Parte Fabricante Existencias Descripción
1542817-1 TE Connectivity 3,000 Heat Sinks 35MM MOUNTING CLIP.
2227644-6 TE Connectivity 3,000 Heat Sinks HEAT SINK CLIP, QSFP28
40137 Vicor 3,000 Heat Sinks 21T #15 WITH TAPE
5078G620200E Axiomtek 3,000 Heat Sinks ETM602 Heatsink w/o grease (H=15) (RC)
PICOHS06M2T2020125KIT TechNexion 3,000 Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
PICOHS06M2T2020175KIT TechNexion 3,000 Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI
PICOHS06M2T2020150KIT TechNexion 3,000 Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7
PICOHS12M2T2020125KIT Wandboard 3,000 Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
82251531000E Axiomtek 3,000 Heat Sinks GOT5153W-834 DRAM SINK_KIT SFP (this kit must be choosen if the operating temperature is over 40 degree )
HSP-EDL-mPCIe-MA2485 ADLINK Technology 3,000 Heat Sinks Heat spreader for EDL-mPCIe-MA2485
32174 Vicor 3,000 Heat Sinks LF 16.26MM CFG C
32439 Vicor 3,000 Heat Sinks HS XF 6.3MM VIC
5078D840300E Axiomtek 3,000 Heat Sinks Heatsink w/o fan for CEM846
HTS-sPX30 ADLINK Technology 3,000 Heat Sinks Heatspreader for LEC-PX30
conga-QA5/HSP-B congatec 3,000 Heat Sinks Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.