Descripción del producto
- Número de parte
- AIAC-1008C-12NK-T
- Fabricante
- Abracon
- categoria de producto
- Inductores fijos
- Descripción
- Fixed Inductors FIXED IND 12NH 900MA 6.5 MOHM
Documentos y Medios
- Hojas de datos
- AIAC-1008C-12NK-T
Atributos del producto
- Core Material :
- AIR
- Height :
- 2.2 mm
- Inductance :
- 12 nH
- Length :
- 2.2 mm
- Maximum DC Current :
- 950 mA
- Maximum DC Resistance :
- 6.5 Ohms
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Style :
- PCB Mount
- Package / Case :
- 1008 (2520 metric)
- Packaging :
- Reel
- Product :
- RF Inductors
- Q Minimum :
- 70
- Self Resonant Frequency :
- 3 GHz
- Series :
- AIAC-1008C
- Shielding :
- Unshielded
- Termination :
- -
- Termination Style :
- SMD/SMT
- Tolerance :
- 10 %
- Width :
- 1.9 mm
Descripción
Fixed Inductors FIXED IND 12NH 900MA 6.5 MOHM
Precio y Adquisiciones
Producto asociado
Usted también podría estar interesado en
Parte | Fabricante | Existencias | Descripción |
---|---|---|---|
40004020 | Würth Elektronik | 5 | Thermal Interface Products WE-TGF Thrml Flr Pad 200mm x 400mm x 2mm |
40003020 | Würth Elektronik | 5 | Thermal Interface Products WE-TGF Thrml Flr Pad 200mm x 400mm x 2mm |
40006010 | Würth Elektronik | 5 | Thermal Interface Products WE-TGF Thrml Flr Pad 200mm x 400mm x 1mm |
40004030 | Würth Elektronik | 5 | Thermal Interface Products WE-TGF Thrml Flr Pad 200mm x 400mm x 3mm |
40006020 | Würth Elektronik | 5 | Thermal Interface Products WE-TGF Thrml Flr Pad 200mm x 400mm x 2mm |
SP400-0.009-00-26 | Bergquist Company | 1,485 | Thermal Interface Products Insulator Plate for Sil-Pad 400, Sil-Pad TSP 900/aka Sil-Pad 400, IDH 2192683 |
SP900S-0.009-AC-137 | Bergquist Company | 1,300 | Thermal Interface Products Sil-Pad, 0.009" Thick, 1Side Adhesive, 1.25x1.0", Sil-Pad TSP 1600S/Sil-Pad 900S |
SP1000-0.009-00-103 | Bergquist Company | 1,528 | Thermal Interface Products Sil-Pad, 0.009", 0.75x0.8", 0.16" Diameter Hole, Sil-Pad TSP 1200/Sil-Pad 1000 |
AL-225-175 | Bergquist Company | 510 | Thermal Interface Products High Performance Phase Change TIM, 2.25 x 1.75 Inch, IDH 2291583 |
2015AC-52 | Bergquist Company | 502 | Thermal Interface Products High Reliability Insulator, Sil-Pad TSP 3500/Sil-Pad 2000, IDH 2192469 |
GPA2000-0.040-02-93 | Bergquist Company | 513 | Thermal Interface Products Thermally Conductive Gap Filling Material, 0.04", GAP PAD TGPA2000/GAP PAD A2000 |
BP660P-0.008-00-1112 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 11x12"SH, 0.008", Adhesive, Bond-Ply TBP 400P/Bond-Ply 660P |
GPVO-0.020-AC-0816 | Bergquist Company | 16 | Thermal Interface Products GAP PAD, 8x16" Sheet, 0.02" Thick, 1 Side Adhesive, GAP PAD TGP 800VO/GAP PAD VO |
LF3800LVO-00-30CC | Bergquist Company | 13 | Thermal Interface Products Liquid Formable Gel, 1-Part, 30CC Plastic Cartridge, Liqui-Form TLF 3800LVO |
SP400-0.007-AC-54 | Bergquist Company | 4,590 | Thermal Interface Products Sil-Pad, Dimensions: 19.05x12.70mm, Sil-Pad TSP 900/Sil-Pad 400, IDH 2167707 |