Descripción del producto

Número de parte
471-3045-100
Fabricante
Amphenol TCS
categoria de producto
Conectores placa a placa y mezzanine
Descripción
Board to Board & Mezzanine Connectors 300P NeXLev Plug 570 Solder Balls

Documentos y Medios

Hojas de datos
471-3045-100

Atributos del producto

Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
1 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 40 C
Mounting Angle :
Vertical
Number of Positions :
300 Position
Number of Rows :
30 Row
Pitch :
1.15 mm
Product :
Plugs
Series :
NeXLev
Stack Height :
12 mm, 15 mm, 20 mm, 25 mm, 28 mm
Termination Style :
BGA
Voltage Rating :
600 V

Descripción

Board to Board & Mezzanine Connectors 300P NeXLev Plug 570 Solder Balls

Precio y Adquisiciones

Producto asociado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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