Descripción del producto

Número de parte
245807018002829+
Fabricante
Kyocera AVX
categoria de producto
Conectores placa a placa y mezzanine
Descripción
Board to Board & Mezzanine Connectors BOARD TO BOARD 18POS

Documentos y Medios

Hojas de datos
245807018002829+

Atributos del producto

Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
300 mA
Housing Material :
Thermoplastic (TP)
Maximum Operating Temperature :
+ 85 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Straight
Number of Positions :
18 Position
Number of Rows :
2 Row
Packaging :
Cut Tape, MouseReel, Reel
Pitch :
0.4 mm
Product :
Receptacles
Series :
5807
Termination Style :
Solder
Voltage Rating :
50 V

Descripción

Board to Board & Mezzanine Connectors BOARD TO BOARD 18POS

Precio y Adquisiciones

Producto asociado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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