sales@szcinty.com
Descripción del producto
- Número de parte
- EW-08-09-G-D-210
- Fabricante
- Samtec
- categoria de producto
- Conectores placa a placa y mezzanine
- Descripción
- Board to Board & Mezzanine Connectors Flexible Board Stacking Header with Fixed Tail Length, 0.100 Pitch
Documentos y Medios
- Hojas de datos
- EW-08-09-G-D-210
Atributos del producto
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Polyester
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 16 Position
- Number of Rows :
- 2 Row
- Packaging :
- Bulk
- Pitch :
- 2.54 mm
- Product :
- Headers
- Series :
- EW
- Stack Height :
- 5.334 mm
- Termination Style :
- Solder
Descripción
Board to Board & Mezzanine Connectors Flexible Board Stacking Header with Fixed Tail Length, 0.100 Pitch
Precio y Adquisiciones
Producto asociado
Usted también podría estar interesado en
| Parte | Fabricante | Existencias | Descripción |
|---|---|---|---|
| PPK4-0.006-00-58 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| SP980-0.009-AC-82 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1680/Sil-Pad 980 |
| HF625-0.005-00-121 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
| PPK4-0.006-00-22 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| SP980-0.009-AC-20 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1680/Sil-Pad 980 |
| PPK4-0.006-00-43 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| PP400-0.009-00-32 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400 |
| Q3-0.005-00-29 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3 |
| Q3-0.005-AC-36 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
| SPK4-0.006-00-51 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4, K4-51, BG90051 |
| SPK4-0.006-00-43 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
| SP400-0.007-00-99 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
| SPK10-0.006-00-75 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1300/Sil-Pad K-10 |
| BP100-0.011-00-24 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| Q3-0.005-AC-31 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
