Descripción del producto

Número de parte
ZW-03-10-T-D-585-125
Fabricante
Samtec
categoria de producto
Conectores placa a placa y mezzanine
Descripción
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 0.100 Pitch

Documentos y Medios

Hojas de datos
ZW-03-10-T-D-585-125

Atributos del producto

Contact Material :
Phosphor Bronze
Contact Plating :
Tin
Housing Material :
Polyester
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Vertical
Number of Positions :
6 Position
Number of Rows :
2 Row
Packaging :
Bulk
Pitch :
2.54 mm
Product :
Headers
Series :
ZW
Stack Height :
14.859 mm
Termination Style :
Solder

Descripción

Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 0.100 Pitch

Precio y Adquisiciones

Producto asociado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Usted también podría estar interesado en

Parte Fabricante Existencias Descripción
173113-0315 FCT 3,000 D-Sub High Density Connectors FCT HD
L177HDE15SD1CH4F48LMT Amphenol Commercial 3,000 D-Sub High Density Connectors 15P HD SOCKET
L77HDC62SD1CO3RC309 Amphenol Commercial 3,000 D-Sub High Density Connectors Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350"), 62 Socket, 0.76um (30u in) Gold, M3 Rear Threaded Insert, Without Boardlock
L77HDC62SD1CO4RC309 Amphenol Commercial 3,000 D-Sub High Density Connectors Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350"), 62 Socket, 0.76um (30u in) Gold, 4-40 Rear Threaded Insert, Without Boardlock
L77HDC62SD1CH3RC309 Amphenol Commercial 3,000 D-Sub High Density Connectors D-SUB HIGH DENSITY
DBMC9H4PJK87 ITT Cannon 3,000 D-Sub High Density Connectors COMBO 9W4 M PCB R/A G HP TIN
L77HDC62SD1CO3FC309 Amphenol Commercial 3,000 D-Sub High Density Connectors Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350"), 62 Socket, 0.76um (30u in) Gold, M3 Front Screwlock, Without Boardlock
L77HDC62SD1CO4FC309 Amphenol Commercial 3,000 D-Sub High Density Connectors Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350"), 62 Socket, 0.76um (30u in) Gold, 4-40 Front Screwlock, Without Boardlock
L77HDC62SD1CH3FC309 Amphenol Commercial 3,000 D-Sub High Density Connectors D-SUB HIGH DENSITY
G17DC15023313EU Amphenol Commercial 3,000 D-Sub High Density Connectors D-Sub, R/A Slim Dip,HD 15F,FP=1.6mm, , 15u" Gold, Pitch=1.0mm, L=3.05mm, Blue, Tape and Reel with cap
G17DC15023313HR Amphenol Commercial 3,000 D-Sub High Density Connectors Dsub Slim R/A Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15u" Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogo
L17HTHCS3R4C Amphenol Commercial 3,000 D-Sub High Density Connectors 62P R/A Hi Density Rear insert M3
10126039-H266XLF Amphenol FCI 3,000 D-Sub High Density Connectors HD D-SUB FEMALE STRAIGHT
L777HDC62PD1CH4R Amphenol Commercial 3,000 D-Sub High Density Connectors D-SUB HIGH DENSITY
L777HDC62PD1CH3F Amphenol Commercial 3,000 D-Sub High Density Connectors D-SUB HIGH DENSITY