Descripción del producto
- Número de parte
- ZW-03-10-T-D-585-125
- Fabricante
- Samtec
- categoria de producto
- Conectores placa a placa y mezzanine
- Descripción
- Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 0.100 Pitch
Documentos y Medios
- Hojas de datos
- ZW-03-10-T-D-585-125
Atributos del producto
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Tin
- Housing Material :
- Polyester
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 6 Position
- Number of Rows :
- 2 Row
- Packaging :
- Bulk
- Pitch :
- 2.54 mm
- Product :
- Headers
- Series :
- ZW
- Stack Height :
- 14.859 mm
- Termination Style :
- Solder
Descripción
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 0.100 Pitch
Precio y Adquisiciones
Producto asociado
Usted también podría estar interesado en
Parte | Fabricante | Existencias | Descripción |
---|---|---|---|
173113-0315 | FCT | 3,000 | D-Sub High Density Connectors FCT HD |
L177HDE15SD1CH4F48LMT | Amphenol Commercial | 3,000 | D-Sub High Density Connectors 15P HD SOCKET |
L77HDC62SD1CO3RC309 | Amphenol Commercial | 3,000 | D-Sub High Density Connectors Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350"), 62 Socket, 0.76um (30u in) Gold, M3 Rear Threaded Insert, Without Boardlock |
L77HDC62SD1CO4RC309 | Amphenol Commercial | 3,000 | D-Sub High Density Connectors Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350"), 62 Socket, 0.76um (30u in) Gold, 4-40 Rear Threaded Insert, Without Boardlock |
L77HDC62SD1CH3RC309 | Amphenol Commercial | 3,000 | D-Sub High Density Connectors D-SUB HIGH DENSITY |
DBMC9H4PJK87 | ITT Cannon | 3,000 | D-Sub High Density Connectors COMBO 9W4 M PCB R/A G HP TIN |
L77HDC62SD1CO3FC309 | Amphenol Commercial | 3,000 | D-Sub High Density Connectors Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350"), 62 Socket, 0.76um (30u in) Gold, M3 Front Screwlock, Without Boardlock |
L77HDC62SD1CO4FC309 | Amphenol Commercial | 3,000 | D-Sub High Density Connectors Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350"), 62 Socket, 0.76um (30u in) Gold, 4-40 Front Screwlock, Without Boardlock |
L77HDC62SD1CH3FC309 | Amphenol Commercial | 3,000 | D-Sub High Density Connectors D-SUB HIGH DENSITY |
G17DC15023313EU | Amphenol Commercial | 3,000 | D-Sub High Density Connectors D-Sub, R/A Slim Dip,HD 15F,FP=1.6mm, , 15u" Gold, Pitch=1.0mm, L=3.05mm, Blue, Tape and Reel with cap |
G17DC15023313HR | Amphenol Commercial | 3,000 | D-Sub High Density Connectors Dsub Slim R/A Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15u" Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogo |
L17HTHCS3R4C | Amphenol Commercial | 3,000 | D-Sub High Density Connectors 62P R/A Hi Density Rear insert M3 |
10126039-H266XLF | Amphenol FCI | 3,000 | D-Sub High Density Connectors HD D-SUB FEMALE STRAIGHT |
L777HDC62PD1CH4R | Amphenol Commercial | 3,000 | D-Sub High Density Connectors D-SUB HIGH DENSITY |
L777HDC62PD1CH3F | Amphenol Commercial | 3,000 | D-Sub High Density Connectors D-SUB HIGH DENSITY |