sales@szcinty.com
Descripción del producto
- Número de parte
- 470-3235-600
- Fabricante
- Amphenol TCS
- categoria de producto
- Conectores placa a placa y mezzanine
- Descripción
- Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Documentos y Medios
- Hojas de datos
- 470-3235-600
Atributos del producto
- Contact Material :
- Copper Alloy
- Contact Plating :
- Gold
- Current Rating :
- 1 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 12.5 Gb/s
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 300 Position
- Packaging :
- Tray
- Pitch :
- 1.15 mm
- Product :
- Receptacles
- Series :
- NeXLev
- Stack Height :
- 26 mm, 28 mm, 30 mm, 33 mm
- Termination Style :
- BGA
- Voltage Rating :
- 600 V
Descripción
Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
Precio y Adquisiciones
Producto asociado
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