sales@szcinty.com
Descripción del producto
- Número de parte
- FW-02-03-L-D-260-065
- Fabricante
- Samtec
- categoria de producto
- Conectores placa a placa y mezzanine
- Descripción
- Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050 Pitch
Documentos y Medios
- Hojas de datos
- FW-02-03-L-D-260-065
Atributos del producto
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 4 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 4 Position
- Number of Rows :
- 2 Row
- Packaging :
- Bulk
- Pitch :
- 1.27 mm
- Product :
- Headers
- Series :
- FW-SM
- Stack Height :
- 6.6 mm
- Termination Style :
- Solder
Descripción
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050 Pitch
Precio y Adquisiciones
Producto asociado
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| DP09HN15B30K | TE Connectivity / Citec | 3,000 | Encoders DP09 HOR 15P NDET 30K M7*7MM |
| DP09HN12B30F | TE Connectivity / Citec | 3,000 | Encoders DP09 HOR 12P NDET 30F M7*7MM |
| DP09H3015A30K | TE Connectivity / Citec | 3,000 | Encoders DP09 HOR 15P 30DET 30K M7*5MM |
| DP09H2412A30K | TE Connectivity / Citec | 3,000 | Encoders DP09 HOR 12P 24DET 30K M7*5MM |
| DP09H3015A30F | TE Connectivity / Citec | 3,000 | Encoders DP09 HOR 15P 30DET 30F M7*5MM |
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