sales@szcinty.com
Descripción del producto
- Número de parte
- CLP-103-02-F-D
- Fabricante
- Samtec
- categoria de producto
- Conectores placa a placa y mezzanine
- Descripción
- Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Documentos y Medios
- Hojas de datos
- CLP-103-02-F-D
Atributos del producto
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 3.4 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 6 Position
- Number of Rows :
- 2 Row
- Pitch :
- 1.27 mm
- Product :
- Sockets
- Series :
- CLP
- Termination Style :
- Solder Pin
- Voltage Rating :
- 280 VAC, 395 VDC
Descripción
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Precio y Adquisiciones
Producto asociado
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