Produktübersicht
- Artikelnummer
- C320C132K3G5TA7301
- Hersteller
- KEMET Electronics
- Produktkategorie
- Vielschicht-Keramikkondensatoren MLCC - bedrahtet
- Beschreibung
- Multilayer Ceramic Capacitors MLCC - Leaded 25V 1300pF C0G 10% LS=2.54mm
Dokumente & Medien
- Datenblätter
- C320C132K3G5TA7301
Produkteigenschaften
- Capacitance :
- 1300 pF
- Dielectric :
- C0G (NP0)
- Lead Spacing :
- 2.54 mm
- Termination Style :
- Radial
- Tolerance :
- 10 %
- Voltage Rating DC :
- 25 VDC
Beschreibung
Multilayer Ceramic Capacitors MLCC - Leaded 25V 1300pF C0G 10% LS=2.54mm
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
Teil | Hersteller | Lager | Beschreibung |
---|---|---|---|
342-90-146-00-591000 | Mill-Max | 3,000 | Headers & Wire Housings Interconnect Header |
329-41-116-41-540000 | Mill-Max | 3,000 | Headers & Wire Housings Interconnect Header |
399-91-011-21-300000 | Mill-Max | 3,000 | Headers & Wire Housings Interconnect Header |
380-90-160-00-001000 | Mill-Max | 3,000 | Headers & Wire Housings Interconnect Header |
399-91-134-10-003000 | Mill-Max | 3,000 | Headers & Wire Housings Interconnect Header |
342-90-124-00-593000 | Mill-Max | 3,000 | Headers & Wire Housings Interconnect Header |
350-90-159-00-006000 | Mill-Max | 3,000 | Headers & Wire Housings Interconnect Header |
334-90-147-00-020000 | Mill-Max | 3,000 | Headers & Wire Housings Interconnect Header |
334-90-112-00-100000 | Mill-Max | 3,000 | Headers & Wire Housings Interconnect Header |
370-90-143-00-001000 | Mill-Max | 3,000 | Headers & Wire Housings Interconnect Header |
STL01511378PCN | TE Connectivity / Nanonics | 3,000 | Headers & Wire Housings STL01511378PCN SMT CONN |
3793-1003 | 3M Connectors | 3,000 | Headers & Wire Housings 10 PIN RT ANG NO LTCH/EJEC .094-.125" |
399-41-136-10-003000 | Mill-Max | 3,000 | Headers & Wire Housings Interconnect Header |
380-90-125-00-001000 | Mill-Max | 3,000 | Headers & Wire Housings Interconnect Header |
342-90-136-00-592000 | Mill-Max | 3,000 | Headers & Wire Housings Interconnect Header |