Produktübersicht

Artikelnummer
27631002RP2
Hersteller
NorComp
Produktkategorie
Stiftleisten und Kabelgehäuse
Beschreibung
Headers & Wire Housings 1X10 HEADER R/A

Dokumente & Medien

Datenblätter
27631002RP2

Produkteigenschaften

Contact Gender :
Pin (Male)
Contact Plating :
Gold
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 40 C
Mounting Angle :
Right Angle
Mounting Style :
Through Hole
Number of Positions :
12 Position
Number of Rows :
1 Row
Packaging :
Bulk
Pitch :
2 mm
Product :
Headers
Row Spacing :
2 mm
Series :
2763
Termination Style :
Solder Pin
Type :
Pin Strip

Beschreibung

Headers & Wire Housings 1X10 HEADER R/A

Preis & Beschaffung

Zugehöriges Produkt

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Das könnte Sie auch interessieren

Teil Hersteller Lager Beschreibung
Q3-0.005-00-55 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3
HF625-0.005-00-50 Bergquist Company 3,000 Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625
PPK10-0.006-00-115 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK1300/Poly-Pad K-10
HF300P-0.0015-00-33 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
SP1100ST-0.012-02-51 Bergquist Company 3,000 Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST
SPA1500-0.010-00-20 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.010 Inch Thick, Sil-Pad TSP A2000/Sil-Pad A1500
HF625-0.005-00-33 Bergquist Company 3,000 Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625
SP800-0.005-00-44 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800
HF625-0.005-00-119 Bergquist Company 3,000 Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625
SPK4-0.006-00-28 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4
SP1100ST-0.012-02-43 Bergquist Company 3,000 Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST
SP400-0.007-00-132 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400
BP100-0.008-00-52 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
SP400-0.007-AC-83 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.007 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400
HF625-0.005-00-45 Bergquist Company 3,000 Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625