Produktübersicht

Artikelnummer
35313-0560
Hersteller
Molex
Produktkategorie
Stiftleisten und Kabelgehäuse
Beschreibung
Headers & Wire Housings 3.96 PITCH W/B CONN WAFER ASSEMBLY

Dokumente & Medien

Datenblätter
35313-0560

Produkteigenschaften

Application :
Power, Wire-to-Board
Contact Gender :
Pin (Male)
Contact Plating :
Tin
Mating Post Length :
5.8 mm
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 40 C
Mounting Angle :
Straight
Mounting Style :
Through Hole
Number of Positions :
5 Position
Number of Rows :
1 Row
Packaging :
Bulk
Pitch :
3.96 mm
Product :
Headers
Series :
35313
Termination Post Length :
3.4 mm
Termination Style :
Solder Pin
Type :
Shrouded

Beschreibung

Headers & Wire Housings 3.96 PITCH W/B CONN WAFER ASSEMBLY

Preis & Beschaffung

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