Produktübersicht
- Artikelnummer
- 008042002200800+
- Hersteller
- Kyocera AVX
- Produktkategorie
- Board-to-Board- und Mezzanine-Steckverbinder
- Beschreibung
- Board to Board & Mezzanine Connectors OTHER CONNECTORS
Dokumente & Medien
- Datenblätter
- 008042002200800+
Produkteigenschaften
- Current Rating :
- 2 A
- Mounting Angle :
- Right Angle
- Number of Positions :
- 2 Position
- Number of Rows :
- 1 Row
- Packaging :
- Tray
- Pitch :
- 2 mm
- Product :
- Connectors
- Series :
- 8042
- Termination Style :
- Solder
- Voltage Rating :
- 150 V
Beschreibung
Board to Board & Mezzanine Connectors OTHER CONNECTORS
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
Teil | Hersteller | Lager | Beschreibung |
---|---|---|---|
AF100-303005 | CUI Devices | 14 | Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 1.0 W/m*K Thermal Conductivity |
AF500-202005 | CUI Devices | 16 | Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 3.0 W/m*K Thermal Conductivity |
AF500-404005 | CUI Devices | 25 | Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 3.0 W/m*K Thermal Conductivity |
QB1005A40WYTB | ATC / Kyocera AVX | 228 | Thermal Interface Products 1005 40mm AlN Edge Wrap |
AF100-204005 | CUI Devices | 17 | Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 1.0 W/m*K Thermal Conductivity |
AF100-313005 | CUI Devices | 17 | Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 1.0 W/m*K Thermal Conductivity |
AF100-404005 | CUI Devices | 42 | Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 1.0 W/m*K Thermal Conductivity |
AF100-414505 | CUI Devices | 17 | Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 1.0 W/m*K Thermal Conductivity |
40011050 | Würth Elektronik | 27 | Thermal Interface Products WE-TGF 1W Square 100x100x5mm |
SF400-313005 | CUI Devices | 12 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 2.5 W/m*K Thermal Conductivity |
SF400-202005 | CUI Devices | 9 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 2.5 W/m*K Thermal Conductivity |
SF400-505005 | CUI Devices | 16 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 2.5 W/m*K Thermal Conductivity |
SF400-153005 | CUI Devices | 9 | Thermal Interface Products Thermal Pad, Silicone Elastomer, 2.5 W/m*K Thermal Conductivity |
40001020 | Würth Elektronik | 13 | Thermal Interface Products WE-TGF 1W Rectangle 400x200x2mm |
AF500-313005 | CUI Devices | 6 | Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 3.0 W/m*K Thermal Conductivity |