Produktübersicht

Artikelnummer
6-1761615-1
Hersteller
TE Connectivity / AMP Connectors
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors STEP-Z 11MM RCPT 200P LF

Dokumente & Medien

Datenblätter
6-1761615-1

Produkteigenschaften

Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
1 A
Housing Material :
Thermoplastic (TP)
Maximum Operating Temperature :
+ 100 C
Minimum Operating Temperature :
0 C
Mounting Angle :
Vertical
Number of Positions :
200 Position
Number of Rows :
18 Row
Packaging :
Tray
Pitch :
1.3 mm
Product :
Receptacles
Series :
Step Z
Termination Style :
Solder
Voltage Rating :
48 VAC

Beschreibung

Board to Board & Mezzanine Connectors STEP-Z 11MM RCPT 200P LF

Preis & Beschaffung

Zugehöriges Produkt

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    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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